1. We manufacture wire bonders, die bonders, die attach, epoxy die attach, pull tester, and shear tester for the semiconductor industry. Levels of automation vary from.
  2. ASM AD520A HIGH SPEED AUTOMATIC WEDGE BONDERS: The AB520A is designed for today's needs for fast turn production of COB/PCB & LED Display devices.
Asm Wire Bonder Manual

K&s Manual Wire Bonders

Wire Bonders manual and semi-automatic ball conder and wedge bonder for open cavity QFN packages, Semiconductor and MEMS.

Palomar Wire Bonder

KULICKE & SOFFA (K&S) AUTOMATIC WIRE BONDERS Kulicke & Soffa (K&S) are the world leaders for automatic wire bonders. The KnS gold wire bonders, copper stud bump / wire & aluminium ultrasonic wedge bonding systems are very easy to operate and are ideal for universities, development laboratories through to medium volume production facilities. K&S also produce a range of fully automatic gold ball bonding machines for high speed IC & MCM assembly, flexible large area hybrid markets and stud bumpers for up to 12' wafers, as well as automatic die bonding systems. These systems provide higher productivity and yields, whilst enabling production of the most complex packages at the lowest cost.

Wire Bonders

Buy/sell new and used bonders for semiconductor applications at LabX. Auctions and For Sale Listings.